Lines Matching full:bond
855 bond function that will start either SSP or SMP.
857 * Parameters: bd_addr - Address of the device to bond
1034 * Parameters: bd_addr - Address of the device to bond
1068 * Parameters: bd_addr - Address of the device to bond
2563 * Description This function is called to report bond cancel complete
2614 /* if the create conn cancel cmd was issued by the bond cancel,
2615 ** the application needs to be notified that bond cancel succeeded
4342 /* Let l2cap start bond timer */
