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m256.mnt24-Aug-20163.1K
m256_bcmp.gbr24-Aug-2016181.4K
m256_bmsk.gbr24-Aug-20163.7K
m256_bslk.gbr24-Aug-201652.7K
m256_drl.drl24-Aug-20164.5K
m256_fab.pdf24-Aug-2016337K
m256_tcmp.gbr24-Aug-2016353K
m256_tmsk.gbr24-Aug-2016136.4K
m256_tpst.gbr24-Aug-2016164.7K
m256_tslk.gbr24-Aug-2016291.8K
README24-Aug-20161.1K

README

      1 PCB Fabrication Package.  Google Mega2560 Arduino Rev. C 2011-03-23
      2 
      3 Gerber Files in RS-274-X Format
      4    m256_tslk.gbr  - Top Silkscreen
      5    m256_tpst.gbr  - Top Solderpaste (Stencil)
      6    m256_tmsk.gbr  - Top Soldermask
      7    m256_tcmp.gbr  - Top Copper
      8    m256_bcmp.gbr  - Bottom Copper
      9    m256_bmsk.gbr  - Bottom Soldermask
     10    m256_bslk.gbr  - Bottom Silkscreen
     11 
     12 Drill files:
     13    m256_drl.drl   - Excellon Drill file
     14 
     15 Fab drawing:
     16 
     17    m256_fab.pdf
     18 
     19 Coordinates:
     20 
     21    m256.mnt       - Top SMD coordinates
     22 
     23 Board dimensions/outline included as zero width trace in silkscreen layer
     24 for reference.  Board is made from 0.062" FR4 with 1oz copper on all
     25 layers.  Minimum trace/space is 6/6 mils.
     26 
     27 NOTE: Board contains 3 plated slots, each slot is marked at the two ends
     28 and center with 0.041" drills.
     29 
     30 Board layers stacked as follows:
     31 
     32      Top Silkscreen (Black)
     33      Top Soldermask (White)
     34      Top Copper (1oz)
     35      FR4 (62 mil)
     36      Bottom Copper (1oz)
     37      Bottom Soldermask (White)
     38      Bottom Silkscreen (Black)
     39 
     40 Process the silkscreen layer against the soldermask layer to prevent
     41 overlapping silkscreen on the pads through mask openings.
     42 
     43